3W Low Cost Thermal Gap Pad Silicone Gap Filler Thermal Conductive Pad For Unmanned Aerial Vehicle(UAV)
Product introduction
The TIF180-30-05S is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
Features:
> Good thermal conductive: 3.0W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> Mass storage devices
> Micro heat pipe thermal solutions
> Display card
> Mainboard/mother board
> Notebook
> Power supply
| Typical Properties of TIF100-30-05S Series |
| Color | Blue | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness | 0.020"(0.5mm)~0.200"(5.0MM) | ASTM D374 |
| Specific Gravity | 3.0g/cc | ASTM D792 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Continuos Use Temp | -45 to 200℃ | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 6.0MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 3.0 W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Company profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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3W Low Cost Thermal Gap Pad Silicone Gap Filler Thermal Conductive Pad For Unmanned Aerial Vehicle(UAV) Images
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